Szczegóły Produktu:
Zapłata:
|
Gęstość: | 3,1 g/cm3 | Moduł sprężystości: | 410 GPA |
---|---|---|---|
Współczynnik rozszerzalności cieplnej: | 4,6 × 10⁻⁶/k | Przewodność cieplna: | 170 W/m · k |
Płaskość: | ≤ 0,5 μm | Oporność: | 10^6 Ω · cm |
Customized SiC Ceramic Suction Cups for Lithography Applications
As a core component of the wafer stage in lithography machines, the silicon carbide (SiC) SiC Ceramic Suction Cups provides an extremely stable and thermally insensitive reference platform for wafers, owing to its ultra-high flatness, high stiffness, and low coefficient of thermal expansion. This is critical for achieving nanometer-level motion accuracy and repeatable positioning. Its internal precision micro-channel structure enables uniform and stable adsorption of the wafer via vacuum negative pressure, avoiding damage or micro-deformation caused by traditional mechanical clamping. Simultaneously, the excellent thermal conductivity of silicon carbide facilitates rapid equilibration of the wafer surface temperature, reducing thermal gradient-induced deformation, thereby ensuring line width uniformity and overlay accuracy. Furthermore, the inherent properties of the SiC Ceramic Suction Cups—being dust-free, wear-resistant, and chemically inert—allow it to meet the stringent requirements of Class 100 and above cleanroom environments, significantly minimizing the risk of wafer defects caused by particle contamination
Parameter Category |
Parameter Name |
Typical Value/Range |
Physical Properties |
Density |
3.1 g/cm³ |
Elastic Modulus |
410 GPa |
|
Bending Strength |
500 MPa |
|
Thermal Properties |
Coefficient of Thermal Expansion |
4.6×10⁻⁶/K |
Thermal Conductivity |
170 W/m·K |
|
Maximum Operating Temperature |
>1600°C |
|
Surface Properties |
Flatness |
≤ 0.5 μm |
Surface Roughness (Ra) |
< 0.1 μm |
|
Adsorption-Related |
Pore Size (Porous Type) |
5 - 50 μm |
Electrical Properties |
Resistivity |
10^6 Ω·cm |
1. Ultra-High Precision & Mirror Polishing:
2. Ultra-Lightweight Design:
3. Exceptional Wear Resistance & High Stiffness:
4. Low Thermal Expansion:
1.Ultra-High Precision Wafer Carrying and Positioning: Leveraging its exceptional flatness (achieving 0.3–0.5 μm), high stiffness, and low coefficient of thermal expansion, the SiC ceramic suction cups provides an extremely stable, flat, and thermally resilient reference platform for the wafer.
2. Vacuum Adsorption and Stable Clamping: Through its precise micro-channel structure, the SiC ceramic suction cup applies vacuum pressure to uniformly and securely adsorb the wafer, preventing any displacement or vibration during high-speed motion.
3. Thermal Management Stability: The high thermal conductivity of silicon carbide facilitates rapid equilibration of the wafer surface temperature, reducing thermal gradient-induced expansion differences, thereby effectively suppressing wafer thermal distortion.
4. Meeting Stringent Cleanroom Requirements: The SiC ceramic suction cups generates no particulate debris, is wear-resistant, has low outgassing, and resists chemical corrosion, enabling it to meet the operational demands of lithography machines in Class 100 or higher cleanroom environments.
Lithography machine worktable
Please feel free to contact us if you have any customization requirements.
Q1: What are silicon carbide (SiC) ceramic suction cups primarily used for?
A1: They are critical for high-precision handling and transport of wafers and sensitive substrates in semiconductor manufacturing, photovoltaics, and precision optics, ensuring contamination-free and stable adsorption under extreme conditions (e.g., high temperature, high vacuum).
Q2: Why choose silicon carbide over other materials for suction cups?
A2: Silicon carbide offers exceptional hardness (Mohs 9.5), high thermal stability (resists temperatures >1600°C), low thermal expansion, and superior chemical inertness, making it ideal for applications demanding ultra-cleanliness, wear resistance, and dimensional stability under thermal stress.
Tags: #SiC Ceramic Suction Cups, #Customized, #Lithography Applications
Osoba kontaktowa: Mr. Wang
Tel: +8615801942596