Diamond-Copper Thermal Composite – High Conductivity, Adjustable CTE & Excellent Stability

Diamond-Copper Thermal Composite – High Conductivity, Adjustable CTE & Excellent Stability

Product Overview

The Diamond-Copper Thermal Conductive Composite is an advanced material fabricated through PVD batch processing of diamond powders. It combines high thermal conductivity, adjustable coefficient of thermal expansion (CTE), high mechanical strength, and reliable thermal stability, making it ideal for power electronics, semiconductors, lasers, and high-performance composite substrates.

Key Advantages

• High Thermal Conductivity: Thermal conductivity exceeds 700 W/m·K, providing superior heat dissipation

• Adjustable CTE: Can be tuned to 5–12 ppm/K by combining with copper or composites (CPC, CMC), reducing the risk of solder joint cracking

• High Mechanical Strength: Flexural strength >300 MPa, ensuring high reliability

• Reliable Thermal Stability: Withstands -65°C to 150°C thermal shocks for 1000 cycles with <5% performance degradation

• Excellent Solderability: Supports copper and silver soldering, easy integration with electronic components

• Cost-Effective & Scalable: Advanced process enables large-area, uniform production

Technical Specifications

Applications

1. High-Power Electronic Component Cooling: Replaces traditional copper substrates, significantly reducing hotspot temperatures

2. Composite Substrates: Can be pressed with CPC or CMC to prepare diamond-copper-CMC composites, controlling overall CTE to 9–12 ppm/K

3. Fully Copper-Encapsulated Composites: Replaces pure copper in high-power modules for improved thermal performance and reliability

Customization

• Customizable thickness, thermal conductivity, and CTE according to project requirements

• Supports various surface treatments and structural designs for complex engineering needs

Processing & Fabrication Capabilities

FAQ

1: What are the main advantages of diamond-copper thermal conductive composites compared to pure copper?

Diamond-copper composites offer significantly higher thermal conductivity (≥700 W/m·K) than pure copper while allowing the coefficient of thermal expansion (CTE) to be tailored between 5–10 ppm/K. This reduces thermal mismatch with semiconductor chips and substrates, lowering the risk of solder joint failure. In addition, diamond-copper materials provide higher stiffness and better thermal stability under repeated thermal cycling.

2: Can the thermal conductivity and CTE be customized for different applications?

Yes. By adjusting the diamond content, copper matrix structure, and composite architecture, the thermal conductivity, thickness, and CTE can be precisely controlled. The material can also be laminated or co-pressed with CPC or CMC substrates, enabling the overall CTE to be tuned to 9–12 ppm/K for improved reliability in high-power electronic modules.

3: Is the diamond-copper composite compatible with standard machining and soldering processes?

The composite is designed to support precision machining and can be supplied with controlled surface roughness and parallelism. It is compatible with copper and silver soldering, allowing easy integration into existing packaging and assembly processes. The material maintains stable performance after 1000 thermal shock cycles from –65°C to 150°C, ensuring long-term reliability.